Numerical Analysis of Flow and Heat Transfer for Semi Spheres Placed As Multiple Serials In a Channel
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Excessive heating of electronic equipments may cause both decreasing thermal performance of system andundesirable consequences such as increased thermal stresses and mechanical defects in the system. In theliterature, there are many studies including applications of thermal analysis and technologies in order to makecooling more effective. In this study, flow and heat transfer were investigated numerically in the case of threedimensional, incompressible, fully developed and laminar flow for semi spheres placed as multiple serials in achannel. The continuity, Navier-Stokes and energy equations were solved numerically by using Ansys Fluent-17.0software program. Air was taken as working fluid. Inlet temperature of the air and sphere surface temperatureswere 300 K and 350 K, respectively. The effects of location of semi spheres as multiple serials, placement angleand positions of sphres according to each other on the pressure drop and heat transfer enhancement for case ofdifferent Re numbers (Re=100, 200, 400 ve 800) were researched. The obtained results showed that the positionsof spheres had a great importance in the case of placement as multiple serials of semi spheres.











